Category: Electronics
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Dymax will demo UV curing workflows at APEX EXPO 2026. The booth programme centres on PCB-level adhesives, coatings, and maskants, pairing automated dispensing with UV/LED curing demonstrations aimed at reliability challenges including outgassing, component stability, and environmental protection.
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Teledyne releases wideband limiter to protect EW receiver front-ends hardware. The passive 0.1–20 GHz module is built to absorb high-power RF before it reaches sensitive electronics, with SMA connectors and fast recovery aimed at retrofit protection in R-ESM and EW systems.
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ifm’s O6D100 tackles black, reflective objects in tight spaces reliably. The PMD time-of-flight distance sensor targets logistics, robotics, and assembly automation, pairing a 3 m range with selectable speed and precision modes over IO-Link for fast retrofits.
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Sony brings drone-ready cameras and LiDAR to Amsterdam Drone Week. The company plans live demonstrations spanning 61MP aerial imaging, 4K60 zoom blocks, and miniature dToF depth sensing for mapping, inspection, surveillance, and traffic operations.
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Vertiv has launched a double-stack busway for AI data centres. The PowerBar Track update is built to raise overhead distribution capacity while preserving white space, with live reconfiguration, optional metering, and safety interlocks aimed at fast-changing colocation and hyperscale deployments.
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Keysight and Samsung are validating AI-RAN from lab to air. At MWC Barcelona, the pair and NVIDIA are demonstrating a single workflow for dataset generation, AI/ML training, and benchmarking, using a PUSCH channel-estimation use case.
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ROHM is bringing TSMC GaN process know-how into Hamamatsu plant. The company plans an end-to-end in-group production system by 2027, targeting demand from AI server power supplies and EV on-board chargers.
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NXP shipped 10BASE-T1S PMD transceivers for multi-drop edge Ethernet networks. New TJA1410 and TJF1410 parts split the PHY between host silicon and a low-pin-count PMD device, aiming to extend Ethernet deeper into automotive, industrial, and building nodes.
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Intelligent Memory is reviving low-density eMMC for long-life industrial designs. The company has launched 8GB and 16GB industrial eMMC in a 153-ball BGA package, aiming to keep embedded platforms supplied as mainstream vendors reduce legacy capacity options.
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Keysight and Ericsson proved pre-6G interoperability using live network hardware. The pair used WaveJudge analysis to troubleshoot signalling between an Ericsson pre-6G gNB and prototype devices ahead of a live demo at Mobile World Congress Barcelona 2026.