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DroneShield has moved counter-UAS manufacturing into Europe for sovereign supply. The first European-built system supports regional demand for AI-enabled drone detection.
Menta and Presto are taking reconfigurable logic into ASIC flows. Their collaboration pairs embedded FPGA IP with industrialisation support for long-lifecycle semiconductor programmes.
NGMN has outlined operator-led guidance for future 6G migration. The papers emphasise spectrum sharing, device readiness, chipset maturity, RF front-end design, and power efficiency as deployment constraints.
Anglia has gained JDI trusted distributor status for display approvals. The move supports faster certification for defence-related projects.
CEA-Leti has demonstrated denser 22nm FeRAM using vertical HZO capacitors. The work targets embedded non-volatile memory for edge AI.
Lantronix has partnered with Cherry and White on rapid connectivity. The platform combines rugged industrial gateways with field-deployable Wi-Fi for critical sites.
MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
NeoCortec is bringing NeoMesh into Endrich’s e-IoT platform for sensors. The wireless mesh layer supports low-power industrial nodes, gateways, and monitoring systems without new cabling.
Thales will supply 60 GO12 radar systems to Germany’s Bundeswehr. The order adds mobile 360-degree ground surveillance for drone and vehicle detection in adverse weather.
GF and Qualinx have completed a European semiconductor manufacturing flow. The Dresden-based process keeps security-critical GNSS chip production inside Europe.
