Category: Embedded systems
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Delta has acquired its German building automation integration partner outright. The deal folds Delta Controls Germany’s European integrator network into Delta’s smart-building portfolio, as building automation and control requirements tighten across the region.
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Rutronik is stocking ADLINK’s cExpress-R8 COM Express edge modules now. The 95 mm × 95 mm Type 6 design combines Ryzen Embedded 8000 compute and an integrated NPU, with up to 96 GB DDR5 and PCIe Gen4 expansion.
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ROHM has added HPLF5060 packages to automotive MOSFETs for 40V/60V. The new footprint targets tighter ECU layouts while improving solder-joint robustness with gull-wing leads and copper clip junctions, aiming at applications such as inverter control, electric pumps, and LED headlamps.
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Vertiv has launched Avocent MergePoint Unity 2 for secure access. The new KVM-over-IP platform targets enterprise and edge estates with FIPS 140-3 cryptography, smart-card authentication, remote BIOS/UEFI access, and virtual media, alongside configurations scaling from 8 to 32 ports.
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ByteSnap and Digi bundle embedded Linux security service. The managed offering targets long-life connected devices, combining vulnerability intelligence, targeted patching, and deployment validation for heterogeneous hardware estates.
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ST’s Stellar P3E MCU integrates dedicated neural acceleration on-chip hardware. The automotive controller uses a Neural-ART Accelerator to run edge inference and virtual sensing alongside safety-focused real-time cores for software-defined vehicle platforms.
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ifm’s O2I2 readers pack high-speed code capture into tight footprints. The compact multicode units read up to 50 codes per second, apply deep learning for damaged marks, and connect via Ethernet or RS232 for tracking, AGVs, and semiconductor traceability.
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Kontron brings Panther Lake and Ryzen AI to Embedded World. New industrial SBC and mITX platforms add integrated NPU acceleration, plus cybersecurity features aligned with EU Cyber Resilience Act requirements.
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RIR introduced 1,200V SiC MPS diodes for EV powertrains today. The TO-247-2L devices span 10A to 40A and target high-frequency power conversion in chargers, inverters, and industrial drives where switching loss and thermal headroom dominate design.
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A low-power sensor node runs machine learning without the cloud. A new modular architecture pairs heterogeneous environmental sensing with on-device inference, adaptive LoRaWAN reporting, and solar-assisted energy management to reduce traffic while keeping event detection local.