Category: Embedded systems
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SolidRun has pushed edge AI deeper into embedded compute. Its new COM Express Type 6 modules pair AMD’s Ryzen AI Embedded P100 with LP-CAMM2 memory and up to 59 TOPS for harsh-environment deployments.
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Sfera Labs has widened Strato Pi Max’s edge deployment reach. Its new M.2 LTE expansion board adds cellular backhaul and GNSS while preserving the platform’s modular DIN-rail architecture.
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Nanopower has taken its nPZero power-saving IC into volume production. The move takes its ultra-low-power companion architecture from evaluation boards into higher-volume IoT design-ins.
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Safety-certified RISC-V development is edging closer to productisation now globally. MIPS and Green Hills have combined processor IP, RTOS, tools, and analysis software into a Safety SDK targeting ASIL-D and SIL 3/4 systems.
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Microchip’s LX4580 consolidates actuation sensing and control into one IC. The 24-channel mixed-signal device targets aviation and defence actuators with redundant architecture, multi-sensor interfaces, and evaluation tools to cut board size, wiring, and integration effort.
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ifm’s O6D100 tackles black, reflective objects in tight spaces reliably. The PMD time-of-flight distance sensor targets logistics, robotics, and assembly automation, pairing a 3 m range with selectable speed and precision modes over IO-Link for fast retrofits.
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XPENG is advancing VLA 2.0 and updating European vehicles now. Global delivery of the next-generation vision-to-action driving stack is planned from 2027, while XOS 5.8.7 begins rolling out in Europe this month with refinements to ACC, lane centring, and connectivity.
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Delta has acquired its German building automation integration partner outright. The deal folds Delta Controls Germany’s European integrator network into Delta’s smart-building portfolio, as building automation and control requirements tighten across the region.
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Rutronik is stocking ADLINK’s cExpress-R8 COM Express edge modules now. The 95 mm × 95 mm Type 6 design combines Ryzen Embedded 8000 compute and an integrated NPU, with up to 96 GB DDR5 and PCIe Gen4 expansion.
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ROHM has added HPLF5060 packages to automotive MOSFETs for 40V/60V. The new footprint targets tighter ECU layouts while improving solder-joint robustness with gull-wing leads and copper clip junctions, aiming at applications such as inverter control, electric pumps, and LED headlamps.