Category: Markets
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Intelligent Memory is reviving low-density eMMC for long-life industrial designs. The company has launched 8GB and 16GB industrial eMMC in a 153-ball BGA package, aiming to keep embedded platforms supplied as mainstream vendors reduce legacy capacity options.
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L3Harris says additive manufacturing is reshaping airbreathing hypersonic propulsion production. The company reports a tenfold reduction in 3D-printed component lead times under a US DoD manufacturing programme.
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Rutronik is stocking ADLINK’s cExpress-R8 COM Express edge modules now. The 95 mm × 95 mm Type 6 design combines Ryzen Embedded 8000 compute and an integrated NPU, with up to 96 GB DDR5 and PCIe Gen4 expansion.
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Nordson will showcase coating and soldering systems at APEX 2026. In Anaheim, the company plans live demonstrations focused on process control, traceability, and higher-yield PCB assembly, including updates to its ASYMTEK Select Coat platform and its SELECT Synchro selective soldering line.
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Mouser is shipping u-blox MAYA-W3 Wi-Fi 6 modules now globally. The host-based range targets healthcare and industrial systems with SISO Wi-Fi 6/6E, Bluetooth Low Energy 5.4 with LE Audio support, multiple antenna options, and evaluation kits intended to accelerate integration.
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ROHM has added HPLF5060 packages to automotive MOSFETs for 40V/60V. The new footprint targets tighter ECU layouts while improving solder-joint robustness with gull-wing leads and copper clip junctions, aiming at applications such as inverter control, electric pumps, and LED headlamps.
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Vertiv has launched Avocent MergePoint Unity 2 for secure access. The new KVM-over-IP platform targets enterprise and edge estates with FIPS 140-3 cryptography, smart-card authentication, remote BIOS/UEFI access, and virtual media, alongside configurations scaling from 8 to 32 ports.
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Northwestern has built a 3D electrode mesh for mini-brain organoids. The soft, shape-conformal framework wraps around organoids, enabling high-density recording and stimulation across most of the tissue surface.
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ByteSnap and Digi bundle embedded Linux security service. The managed offering targets long-life connected devices, combining vulnerability intelligence, targeted patching, and deployment validation for heterogeneous hardware estates.
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Astute will showcase Mobile Mark antennas at Enforce Tac 2026. The Hall 9 presence positions UK-built RF hardware for European defence integrators seeking rugged, high-performance communications across specialist and conventional bands.