SolarEdge and Infineon are developing semiconductor protection for 800VDC distribution. Their solid-state circuit-breaker architecture uses silicon carbide JFET technology to target microsecond fault isolation between high-voltage conversion equipment and increasingly power-dense AI compute racks.
Infineon has integrated traction-inverter power management and safety functions together. TLE9744QK also incorporates resolver excitation and independent fault supervision.
Murata has added nine automotive power-inductor values for ADAS designs. The AEC-Q200 parts extend a 2.0 × 1.6mm series already in mass production.
Infineon has introduced dual-phase power stages for dense AI accelerators. The 6mm devices support 300A peak current, vertical power delivery, and liquid-cooling integration.
NOVOSENSE is expanding GaN products for AI server power systems. Its portfolio spans AC-DC conversion, 800 V HVDC, rack-level conversion, isolation, sensing, gate driving, and real-time control.
Infineon and Skeleton will develop denser AI power delivery systems. Their MoU covers SiC solid-state transformers and GaN peak-shaving sidecars using supercapacitor storage.
Sypris has secured follow-on missile avionics power-supply module production work. Deliveries under the latest award are scheduled to begin in early 2027.
FSP has introduced dual-voltage 3.2kW CRPS modules for AI systems. Separate 12V and 54V versions combine Titanium efficiency, PMBus telemetry, redundant operation, and short-duration peak-power capability for increasingly dense accelerator hardware.
EPC has started volume production of four integrated GaN stages. The 100V devices combine high-side and low-side transistors, gate drivers, level shifting, and protection for compact motor-drive and power-conversion designs.
Infineon is supplying CoolSiC MOSFETs for Fox ESS storage systems. The 1200 V devices cut switching losses by 70%, lifting PQ3-Ultra peak inverter efficiency to 98.78%.