Category: Power supplies
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TDK has introduced B25696H DC-link capacitors for SiC converter designs. The MKP film series targets high-frequency power stages across storage, traction, renewables, and drives.
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ROHM has introduced TSC3PAK for top-side-cooled SiC MOSFET power packages. The package combines surface-mount assembly with insulation and thermal performance for high-voltage power conversion.
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CGD and NXP are collaborating on GaN power-conversion system designs. The work targets data-centre, automotive, and industrial designs needing higher efficiency and density.
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CSA Catapult will become the UK’s Semiconductor Catapult this summer. The transition broadens support for chip R&D, validation, commercialisation, and AI hardware deployment.
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QPT has launched qDesign for AI-optimised power module packaging workflows.
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Cambridge GaN Devices is sampling automotive ICeGaN for inverter designs.
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ODU has supplied mass interconnects for automated DEIF converter testing.
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Cyntec is showing battery junction box components for EV architectures.
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onsemi has launched a SiC pairing tool for power designers.
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Fraunhofer IAF is demonstrating GaN power modules for bidirectional charging.