Infineon will supply SiC modules for Siemens semiconductor circuit breakers.
ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.
Mouser is shipping TDK’s AMT45S pulse transformer for EV charging. The compact component targets power line communication circuits used in CCS and NACS charging systems, supporting isolation, signal integrity, and charging control.
Power Integrations has introduced compact 800VDC auxiliary PSU designs. The 15W and 35W flyback references use 1700V PowiGaN InnoMux-2 ICs for high-voltage AI data-centre architectures based on NVIDIA Kyber.
SemiQ will show expanded SiC power modules at PCIM Europe. The portfolio includes QSiC Dual3 devices, AlN substrate options, pre-applied thermal interface material, and high-current packages for AI infrastructure, EV charging, storage, solar, and industrial drives.
Toshiba has introduced automotive MOSFETs for compact power switching designs. The 40V N-channel devices use SOP Advance(EWF) packaging to improve current capability, reduce on-resistance, and support vehicle systems including load switches, relays, inverters, and motor drives.
ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.