Infineon has joined NVIDIA’s MGX ecosystem for AI rack power. The collaboration supports 800VDC architectures using silicon, silicon carbide, and gallium nitride technologies to improve power delivery in high-density AI data centres.
Vishay has expanded its IHXL inductor range for high-current designs. The new automotive-grade and commercial devices offer current ratings up to 209A, lower core losses, and operation to +155°C.
iDEAL Semiconductor will showcase SuperQ silicon MOSFET technology at PCIM. The architecture targets lower conduction and switching losses while keeping designers within familiar silicon manufacturing, packaging, and qualification routes.
ROHM has released a web-based PLECS simulator that allows power electronics designers to evaluate losses, temperature rise, waveforms, and device selection during early circuit development.
Nexperia will use Polar Semiconductor’s Minnesota wafer facility to manufacture next-generation power MOSFETs, strengthening supply for AI infrastructure, robotics, industrial, and automotive applications.
Microchip has introduced 3.3kV SiC power modules for solid-state transformers, AI data centres, megawatt charging, rail, medium-voltage drives, and industrial power systems.
The European Commission has selected 65 electrified industrial heat projects for around €400m of support, creating further demand for power conversion, controls, and sensing technologies.
STMicroelectronics has added seven 700V PowerGaN devices for high-density industrial power conversion, targeting AI servers, robotics, smart-grid converters, and solar inverters.
Wolfspeed has introduced two 3.3 kV silicon carbide power module families for AI data centres, renewable energy, storage, and high-voltage conversion infrastructure.