Infineon has opened its €5bn Smart Power Fab in Dresden. The site doubles local power semiconductor and analogue/mixed-signal capacity for AI infrastructure, grids, renewables, vehicles, and industrial systems.
Vertiv has opened a Malaysian facility for AI infrastructure manufacturing. The Johor site supports power, cooling, testing, and modular deployment.
Toshiba has launched an 80V MOSFET for AI infrastructure power. The device targets switched-mode supplies in data centres, base stations, and industrial equipment.
OMRON has introduced high-voltage SiC relays for demanding switching applications. The G3VH range targets industrial drives, renewables, storage, and semiconductor test.
Kyocera AVX has launched traction-grade capacitors for high-voltage converter platforms. The FFLK series targets EV traction, drives, and DC-link filtering.
SK keyfoundry has integrated EMC protection into automotive semiconductor designs. The Bi-SCR technology targets PMICs, motor drivers, and power-control ICs.
AI infrastructure management is becoming a rack-level electronics discipline now. KAYTUS has launched KSManage Ultra to monitor compute, power, networking, cooling, racks, and clusters.
Power IC integration is moving further onto engineered substrates now. Soitec and ZenSemi will scale 300mm BCD-on-SOI production for AI, EV, robotics, storage, and industrial systems.