Infineon has expanded its CoolGaN BDS 40 V G3 bidirectional switch family with two devices designed to reduce PCB area and component count in compact power-path designs.
WireFlow has introduced its 5200 series battery monitoring and balancing system, combining a 12-channel node with USB and EtherCAT gateways for EV, ESS, laboratory, and industrial battery test environments.
Infineon will use PCIM Europe 2026 to present silicon, SiC, and GaN technologies for AI data centres, robotics, solid-state power infrastructure, energy storage, and electromobility.
Infineon is coordinating Moore4Power, a €91m European project focused on heterogeneous integration for next-generation smart power electronics.
Vishay has introduced automotive-grade optocouplers with wider creepage and clearance distances for EV, solar inverter, and high-voltage isolation stages.
Nvidia has reported record first-quarter revenue of $81.6bn, as AI infrastructure demand continues to reshape processor, memory, networking, and power design.
AI server growth is putting renewed pressure on high-capacitance MLCC availability, pulling passive components back into design and sourcing risk.
Melexis has introduced an 18-channel LIN RGB LED controller with an integrated 1A DC/DC converter for compact automotive lighting modules.
Analog Devices will acquire Empower Semiconductor for $1.5bn, adding integrated voltage-regulator and silicon-capacitor technologies for high-density AI compute power delivery.
TDK will use PCIM Europe 2026 to show passive components, sensors, contactors, µPOL converters, and power-stage technologies for AI data centres, electrification, industrial drives, and EV infrastructure.