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Abaco brings Core Ultra 3 to rugged VPX

Abaco brings Core Ultra 3 to rugged VPX

Prima Electro targets Farnborough electronics programmes

Prima Electro targets Farnborough electronics programmes

HANZA consolidates Finnish electronics manufacturing operations

HANZA consolidates Finnish electronics manufacturing operations

Rohde & Schwarz sharpens mixed-domain EMC debugging

Rohde & Schwarz sharpens mixed-domain EMC debugging

Spain connects semiconductor projects through domestic alliance

July 15, 2026
Infineon targets solid-state DC power infrastructure

July 15, 2026
NextGO Epi funds gallium-oxide wafer scale-up

July 15, 2026
Kontron starts German industrial 5G module production

July 15, 2026
Germany clears €659m for four semiconductor plants

July 15, 2026
Intel commits €5bn to Leixlip processor output

July 15, 2026
ADIOS expands stocked component range to 700,000

July 14, 2026
Vishay narrows automotive optocoupler for high-voltage systems

July 14, 2026

Latest industry news

GCAP contract sharpens combat-air electronics challenge

9/7/2026

Edgewing’s GCAP contract brings combat-air electronics into sharper focus now.…
IMRA advances injection-locked THz source architecture

9/7/2026

IMRA America has demonstrated a higher-stability THz source architecture today.…
Melexis digitises current sensing for EV inverters

9/7/2026

Melexis has introduced a digital Hall current sensor for inverters.…
SYSGO hardens industrial Linux for embedded systems

9/7/2026

SYSGO has released ELinOS 8 for secure embedded deployments today.…
IHP opens chiplet assembly design route

9/7/2026

IHP has released a European open-source assembly design kit today.…
Cyber pledge sharpens IoT resilience

8/7/2026

Wireless Logic has urged operational focus on connected-device resilience controls.…

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Featured

High-power delivery for industrial AI-ready networks
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Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Jul 4

2026

Dismantled: Q2 2026
Jun 25

2026

Resilience as the cornerstone of medical device manufacturing
Jun 19

2026

IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic
Jun 18

2026

The manufacturing challenge facing scaling UAV developers
Jun 16

2026

Building traceability and control in battery manufacturing
Jun 15

2026

The trials and tests of the best available adhesive

Electronics

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HANZA consolidates Finnish electronics manufacturing operations

HANZA is consolidating selected Finnish electronics production at Oulainen facility.…

Rohde & Schwarz sharpens mixed-domain EMC debugging
Kontron starts German industrial 5G module production
Germany clears €659m for four semiconductor plants
Intel commits €5bn to Leixlip processor output
ADIOS expands stocked component range to 700,000

Design engineering

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Prima Electro targets Farnborough electronics programmes

Prima Electro will debut its custom electronics capability at Farnborough.…

Rohde & Schwarz sharpens mixed-domain EMC debugging
Spain connects semiconductor projects through domestic alliance
Ultra-thin electrical steel targets efficient motors
Imec and Diraq scale silicon spin qubits
PerkinElmer and Covalent deepen electronics failure analysis

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