Molex has unveiled a compact quad-row board-to-board connector with integrated EMI shielding. The innovation targets high-density consumer and wearable electronics, improving signal integrity and power delivery while eliminating the need for external shielding hardware.
Altus Group introduces Heller’s Short-Cycle Vacuum Reflow Oven. The innovative system addresses vacuum soldering cycle time limitations, enhancing high-volume production capabilities. Heller’s patented multi-stage conveyor technology increases throughput by up to 100%, ensuring superior solder joint reliability. This advancement supports the growing demand for high-reliability electronics manufacturing across the UK and Ireland.
Cliff Electronics unveils advanced SMA and RP-SMA connectors. The new CP30260 range offers solderless female-to-female connectivity, designed for RF communication systems, telecom, and aerospace applications. With a frequency range up to 18 GHz and gold-plated finishes, these connectors ensure secure, low-loss connections for high-frequency environments.
Wireless Logic has been named “Overall IoT Solution Provider of the Year.” The UK-based connectivity specialist received the award in the 2025 Mobile Breakthrough Awards, recognising its continued focus on secure and scalable IoT infrastructure.