Samtec has added through-hole options to mPOWER connectors. The ultra-micro power interconnect family targets high-current, space-constrained designs requiring stronger mechanical retention in industrial, aerospace, and military environments.
Q5D and Kyocera AVX are developing automated IDC connectors. The collaboration targets robotic wire-harness assembly for aerospace, automotive, white goods, and industrial systems where manual harness work remains a production bottleneck.
ESA is expanding Arctic sensor infrastructure in Finnish Lapland. The Sodankylä supersite will add radiometry, greenhouse gas sensing, and airborne survey capability to strengthen satellite calibration and validation across Arctic and boreal environments.
Weald Electronics has marked 50 years of UK connector manufacturing, highlighting long-life circular, rectangular, PCB, and accessory products for harsh-environment applications.
Richardson RFPD has added custom EMI-filtered MIL-DTL-38999 connectors.
CEA-Leti will focus its summit on sustainable AI semiconductors.
Microchip has opened a new Tuscaloosa facility to increase production of its MHM-2020 Active Hydrogen Maser and reduce lead times for precision timing systems.
Teledyne FLIR Defense has certified Emesent’s Hovermap LiDAR payload for unmanned air, ground, and radiation-detection platforms, adding GPS-denied 3D mapping capability.
Rohde & Schwarz will show new high-gain antennas and speed-optimised EMI testing at APEMC 2026, targeting commercial, automotive, aerospace, and defence compliance work.