Category: Embedded systems
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Anglia has gained JDI trusted distributor status for display approvals. The move supports faster certification for defence-related projects.
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CEA-Leti has demonstrated denser 22nm FeRAM using vertical HZO capacitors. The work targets embedded non-volatile memory for edge AI.
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Lantronix has partnered with Cherry and White on rapid connectivity. The platform combines rugged industrial gateways with field-deployable Wi-Fi for critical sites.
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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NeoCortec is bringing NeoMesh into Endrich’s e-IoT platform for sensors. The wireless mesh layer supports low-power industrial nodes, gateways, and monitoring systems without new cabling.
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Thales will supply 60 GO12 radar systems to Germany’s Bundeswehr. The order adds mobile 360-degree ground surveillance for drone and vehicle detection in adverse weather.
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GF and Qualinx have completed a European semiconductor manufacturing flow. The Dresden-based process keeps security-critical GNSS chip production inside Europe.
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Altera is now sampling Agilex 9 Direct RF-Series SoC FPGAs. The devices integrate converters, programmable logic, processing, memory, and RF capability.
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RISC-V Summit Europe has opened in Bologna around deployable hardware. The programme spans embedded systems, AI, automotive, security, software, and space.
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CEA-Leti and GlobalFoundries are extending FD-SOI research through Europe’s FAMES. The pilot line targets low-power, sovereign silicon for advanced applications.