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QuickLogic has expanded eFPGA hard IP for GlobalFoundries 12LP technology. The architecture now scales beyond 250,000 LUTs while adding enhanced DSP functions and optional configuration-bit error monitoring.
IDS is expanding industrial vision across cameras, AI, and 3D. VISION 2026 demonstrations span event-based sensing, embedded multicamera processing, time-of-flight depth capture, and edge inference.
SomDevices modules are joining CELUS to simplify embedded architecture decisions. Seven NXP-based μSMARC variants will become reusable design blocks supporting earlier interface, schematic, and bill-of-material decisions.
SiMa.ai and ARK Electronics have launched production-ready drone AI bundles. Modalix delivers 50 TOPS below 10W in Jetson-compatible carrier-board formats.
Qualcomm has launched IQ-2390 for compact industrial edge computing platforms. The processor combines AI, vision, TSN networking, real-time control, and long-lifecycle support.
GigaDevice expands component distribution through a new Rutronik franchise agreement. The deal covers EMEA and Southeast Asia, widening access to GD32 microcontrollers, sensors, and power-management devices with local engineering and logistics support.
e-con Systems has achieved automotive quality certification for camera manufacturing. IATF 16949 covers forward, rear, surround-view, and driver-monitoring cameras while introducing automotive-specific controls from product development through production and supplier management.
Aetina has launched a 2U platform for edge AI workloads. The AIP-RQ87 supports Intel Core Ultra processors, PCIe Gen5 expansion, high-power NVIDIA or Qualcomm acceleration, 256GB of DDR5, and a 2,000W maximum loaded configuration.
Renesas has opened a Beijing laboratory for physical AI robotics. The facility combines processing, sensing, power, software, control, and system verification as the semiconductor supplier expands its role in complete robot development.
Aetina will support NVIDIA’s new Jetson Orin Nano 2 platform. The 78 TOPS module targets compact robotics, vision systems, and multimodal edge AI within constrained power budgets.
