Category: Embedded systems
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INTERA has introduced licensable accelerator IP for embedded AI designs. EAGLE Cognit combines near-memory matrix-vector processing, configurable precision and support for classical and spiking neural networks.
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TIER IV and Munich researchers have established an Autoware centre. The collaboration will develop safety supervision, repeatable verification methods and deployment processes for autonomous driving software, building on the university’s existing EDGAR research platform.
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Quintauris and Microchip will collaborate on RISC-V validation and integration. The partnership brings benchmarking and software integration services into Microchip’s processor development activities, targeting interoperability and portability across embedded implementations.
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Elektrobit and Microchip are extending AUTOSAR support across automotive platforms. Initial EB tresos operating system and basic software modules are available for Microchip’s SAMA5 microprocessors, with additional platform support planned.
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Altair is adding satellite connectivity support to two cellular chipsets. Its Iridium NTN Direct integration is designed to extend industrial IoT coverage beyond terrestrial networks without a separate modem.
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BrainChip has introduced Sequora processor IP for embedded sequence processing. Its state-space architecture is intended to limit context-related memory growth while supporting generative models on selected edge hardware.
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d-Matrix has begun shipping multi-rack Squadron systems for AI inference. The architecture scales Corsair accelerators through networked air-cooled racks and has demonstrated a mixed GPU-XPU pipeline for a defined language model.
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Fibocom has introduced its new SC153 5G smart computing module. The Qualcomm-based design combines sub-6GHz connectivity, Android processing and multiple hardware interfaces, with volume production scheduled for the fourth quarter.
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Rockwell has introduced a compact controller with integrated safety functions. The 5390 adds local PointMax I/O and security features, with availability scheduled for late 2026.
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TDK has expanded worldwide access to its PositionSense orientation platform. Four hardware pairings combine a six-axis inertial sensor with a three-axis magnetometer and on-chip fusion software.