Category: Markets
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IDS cameras are supporting 3D reconstruction of plasma jet behaviour. The work links industrial imaging with scientific, medical, and high-speed measurement applications.
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APEM and Alps Alpine Europe are expanding industrial HMI collaboration. The work targets integrated controls for material handling, machinery, and off-highway equipment.
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Data-centre power design is shifting rapidly toward higher-voltage distribution architectures. Rack-level storage and solid-state protection are becoming central to AI infrastructure engineering.
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STMicroelectronics is advancing edge imaging beyond conventional camera component boundaries. Its FlightSense and BrightSense platforms combine depth sensing, vision, local processing, and low-power operation.
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MEMPHIS Electronic will address memory uncertainty at FMS 2026 soon. Its focus is availability, migration, and lifecycle planning for embedded designs.
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ROHM has detailed fifth-generation SiC MOSFETs for power conversion systems. The devices target lower losses and higher density in automotive, server, and industrial applications.
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SiTime has completed its acquisition of Renesas’ timing business unit. The deal expands precision clocking capacity for AI, communications, automotive, and industrial electronics.
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Lauterbach has added TRACE32 support for NXP CoolFlux DSPs development. The update extends debug and non-intrusive trace coverage for low-power signal-processing systems.
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Anritsu has expanded RedCap testing for emerging 5G devices applications. The software covers throughput, handover, power, temperature, and band-combination checks.
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Rutronik is offering Intel processors for physical AI systems deployments. The devices combine CPU, GPU, and NPU resources for robotics and automation.