Category: Markets
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Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.
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Ultralytics has optimised YOLO26 models directly for Intel edge processors. OpenVINO deployment spans CPUs, integrated GPUs, and NPUs for industrial vision.
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Portwell has expanded its SMARC platform for compact edge systems. PCOM-BC00 combines Intel Atom processing, LPDDR5, dual 2.5GbE, cameras, and industrial-temperature options.
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TU Eindhoven has expanded semiconductor research links with Arizona universities. The five-year partnership covers photonics, computing, education, and industrial placements.
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Amkor secured a multiyear NVIDIA advanced-packaging and semiconductor-testing supply agreement. Supported by a $1.5 billion prepayment, the deal expands US AI assembly capacity.
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Signify recorded weaker European professional-lighting demand during its second quarter. Comparable sales fell 3.6%, while adjusted EBITA margin declined to 6.1%.
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Navitas and Magnachip will jointly manufacture higher-voltage silicon carbide devices. Ratings from 1,200V beyond 3,300V will address grid, storage, transport, and industrial conversion systems.
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Exascend has extended rugged storage into industrial PCIe 5.0 systems. New enterprise and embedded options combine high capacity, power-loss protection, wide-temperature operation, and endurance-focused pSLC configurations.
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Fortec UK has introduced one converter for five railway voltages. The 150W HFC150-W/G accepts inputs from 14.4V to 154V, allowing one power architecture to span several rolling-stock platforms.
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LUCI and TALQ are aligning urban lighting with interoperable controls. Their partnership connects municipal experience with an open protocol for managing outdoor lighting and other smart-city systems.