Emerson launches NI CHESS for lab-based aerospace RF link validation.
Nordson Electronics Solutions has taken the 2025 EM Asia Best Supplier of the Year award, adding further weight to its position in Asian electronics manufacturing equipment markets spanning dispensing, coating, selective soldering, and plasma treatment.
STMicroelectronics has expanded its GaN drive portfolio with 220V and 600V half-bridge devices that combine fast timing, integrated regulators, and fault handling for motor drives and high-frequency power conversion.
TPK and ASE are moving into through-glass via packaging with a pilot line planned for the third quarter of 2026, adding another sign that glass-core substrates are edging closer to practical deployment in high-performance semiconductor packaging.
IBASE has launched an AI-ready eATX board for edge deployments. Built around AMD EPYC Embedded 8004 processors, the MBB1002 targets smart manufacturing, transport, and AIoT systems needing dense PCIe Gen5 expansion and ECC memory.
Abaco Systems has launched the VP892, a rugged 3U VPX FPGA engine built around AMD’s VU13P, extending compute density, bandwidth, and programme life for demanding defence and industrial embedded platforms.
Samtec has launched an in-house Upscreen Testing service for military and aerospace interconnects, offering a faster route to lot screening, conformance inspection, and traceable qualification support around COTS-based designs.