Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
AMD has signed a new letter of intent with the French government to expand AI infrastructure, training, and ecosystem support, while reinforcing its role in Alice Recoque, France’s planned first exascale supercomputer and a central platform in the country’s wider AI strategy.
Infineon’s radiation-hardened semiconductors have completed NASA’s ten-day Artemis II mission aboard Orion, providing validated performance in deep-space power, control, and communications functions at a time when spacecraft electronics are facing rising pressure on size, weight, and efficiency.
TDK-Lambda has launched a 1500W AC-DC module series aimed at industrial, lighting, and building automation equipment, combining a wide 85-305 Vac input range with PMBus control, sealed-enclosure suitability, and support for parallel operation in higher-power designs.
AliveCor has received CE mark for its Kardia 12L system, bringing a single-cable, AI-powered handheld 12-lead ECG platform to the European market.
ASML posted €8.8 billion in first-quarter net sales and lifted its full-year outlook, reinforcing how AI-driven fab investment is continuing to shape lithography demand.