Altus is expanding its Redditch headquarters around connected production lines. The centre will integrate SMT, through hole, backend, and component management equipment.
SK hynix has begun shipping HBM4 during another record quarter. HBM4E samples, sixth generation DRAM, and 321 layer NAND extend its AI memory roadmap.
Toray’s polymer film could substantially reduce lithium ion collector weight. The copper coated substrate is now being sampled from production equipment.
Weald has expanded UK access to rugged connectors through Rayfast. The agreement covers interconnect products for defence, medical, energy, and industry.