Panasonic Industry has introduced the FX-250 digital fibre sensor, combining faster response, simplified threshold setting, and lower operating overhead for compact factory automation and difficult-part detection tasks.
EIZO Rugged Solutions has launched a 24.1-inch rugged LCD monitor for ECDIS, radar, and integrated bridge navigation roles in naval and maritime systems.
Columbia Engineering has detailed a flexible brain-computer interface chip that combines dense neural recording, stimulation, telemetry, and wireless power on one implantable substrate.
Positron has landed Oracle as an early customer and is preparing its Asimov AI processor for launch in 2027. The design avoids CoWoS and HBM, instead using LPDDR-based memory architecture and air-cooled deployment to target inference workloads in power-constrained data centres.
SEMI is using its June policy forum in Brussels to push for a more comprehensive Chips Act 2.0, with the agenda moving beyond fab announcements toward resilience, competitiveness, skills, security, and the harder work of building a durable European semiconductor ecosystem.
IDC has sharply lowered its 2026 smartphone forecast as memory constraints worsen. The market is now expected to fall to 1.12 billion units, with higher DRAM and NAND pricing pushing vendors toward reduced configurations, higher ASPs, and tougher product decisions.
Farnell has added Lovato Electric’s automation and protection hardware to its industrial portfolio, bringing contactors, switch disconnectors, motor-protection relays, safety devices, signalling products, and circuit-protection components into a broader stocked channel for control and power applications.