Category: Markets
-
TDK-Lambda has introduced a 1U 3.5kW hot-swap supply for industry. The HFE3500 series supports redundant rack configurations and parallel operation, targeting automation, ATE, and communications systems that need high-density bulk power with monitoring and control via PMBus.
-
Variscite has launched its first SMARC module family today, globally. The VAR-SMARC-MX8M-PLUS targets compact industrial and medical edge designs, combining NXP’s i.MX 8M Plus with dual Gigabit Ethernet (IEEE1588 support), expanded USB, and an on-module TPM 2.0 security device.
-
Raspberry Pi is raising prices again across higher-memory boards globally. The company cites sharply higher LPDDR4 costs, with increases applied to Raspberry Pi 4 and 5, plus Compute Module 4 and 5 products at 2GB and above, while 1GB variants and LPDDR2-based products are unaffected.
-
Component obsolescence remains a persistent risk for electronics manufacturers globally. ByteSnap Design has launched a free interactive BOM Health Self-Assessment tool to help engineering leaders quantify their exposure and evaluate whether existing BOM management processes are sufficient before disruption occurs.
-
UCLA scientists cut flicker noise in nanowires for sensors dramatically. The team demonstrated an ultra-low-noise transport regime in quasi-1D materials, indicating a path toward higher-fidelity medical sensing and more stable quantum devices.
-
Munich researchers have built Europe’s first 7nm AI chip prototype. The RISC-V, neuromorphic design targets ultra-low-power on-device inference, with an eye on security-sensitive industrial and medical workloads. TUM’s MACHT-AI centre is backing further tape-outs on advanced FinFET nodes.
-
The FDA’s QMSR is now effective for US device makers. The rule updates 21 CFR Part 820 by incorporating ISO 13485:2016 by reference, shifting both documentation expectations and inspection mechanics for medical electronics manufacturers selling into the US market.
-
Microservice Store is pitching a marketplace for embedded software blocks. Its Embedded Microservices model packages verified functionality as isolated native executables, aiming to let engineers patch devices component-by-component on MCUs as small as Arm Cortex-M0.
-
BAE Systems has secured a $473m US Army Paladin order. The award covers 40 more M109A7 howitzer sets, including M992A3 ammunition carriers, plus support services. For electronics teams, the programme’s high-voltage electrical system and growing digital integration remain the upgrade pathway.
-
Lanner’s EAI-I351 targets rugged robotics with Jetson Thor compute modules. Built for multi-sensor autonomy workloads, the appliance pairs high-bandwidth networking with camera-centric I/O and a wide operating temperature range.