Positron has landed Oracle as an early customer and is preparing its Asimov AI processor for launch in 2027. The design avoids CoWoS and HBM, instead using LPDDR-based memory architecture and air-cooled deployment to target inference workloads in power-constrained data centres.
SEMI is using its June policy forum in Brussels to push for a more comprehensive Chips Act 2.0, with the agenda moving beyond fab announcements toward resilience, competitiveness, skills, security, and the harder work of building a durable European semiconductor ecosystem.
IDC has sharply lowered its 2026 smartphone forecast as memory constraints worsen. The market is now expected to fall to 1.12 billion units, with higher DRAM and NAND pricing pushing vendors toward reduced configurations, higher ASPs, and tougher product decisions.
Farnell has added Lovato Electric’s automation and protection hardware to its industrial portfolio, bringing contactors, switch disconnectors, motor-protection relays, safety devices, signalling products, and circuit-protection components into a broader stocked channel for control and power applications.
Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
AMD has signed a new letter of intent with the French government to expand AI infrastructure, training, and ecosystem support, while reinforcing its role in Alice Recoque, France’s planned first exascale supercomputer and a central platform in the country’s wider AI strategy.
Infineon’s radiation-hardened semiconductors have completed NASA’s ten-day Artemis II mission aboard Orion, providing validated performance in deep-space power, control, and communications functions at a time when spacecraft electronics are facing rising pressure on size, weight, and efficiency.