Infineon tightens automotive semiconductor lead as MCU share climbs globally.
Synopsys backs Artemis electronics modelling for lunar suits and connectivity.
Emerson launches NI CHESS for lab-based aerospace RF link validation.
Nordson Electronics Solutions has taken the 2025 EM Asia Best Supplier of the Year award, adding further weight to its position in Asian electronics manufacturing equipment markets spanning dispensing, coating, selective soldering, and plasma treatment.
STMicroelectronics has expanded its GaN drive portfolio with 220V and 600V half-bridge devices that combine fast timing, integrated regulators, and fault handling for motor drives and high-frequency power conversion.
TPK and ASE are moving into through-glass via packaging with a pilot line planned for the third quarter of 2026, adding another sign that glass-core substrates are edging closer to practical deployment in high-performance semiconductor packaging.