Category: Markets
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IBASE has launched an AI-ready eATX board for edge deployments. Built around AMD EPYC Embedded 8004 processors, the MBB1002 targets smart manufacturing, transport, and AIoT systems needing dense PCIe Gen5 expansion and ECC memory.
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Abaco Systems has launched the VP892, a rugged 3U VPX FPGA engine built around AMD’s VU13P, extending compute density, bandwidth, and programme life for demanding defence and industrial embedded platforms.
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Samtec has launched an in-house Upscreen Testing service for military and aerospace interconnects, offering a faster route to lot screening, conformance inspection, and traceable qualification support around COTS-based designs.
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Eclipse hawkBit 1.0 brings a production-ready open-source backend for OTA software updates, giving embedded teams a more mature route to device rollout control, security policy enforcement, and long-term fleet management.
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BAE Systems has completed a Typhoon firing trial with the APKWS laser-guidance kit in the UK, opening a lower-cost path for counter-UAS integration while adding another weapons-upgrade thread to the fighter’s development roadmap.
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NXP has launched an omlox starter kit for RTLS deployments. The platform combines UWB hardware, tags, anchors, middleware, and analytics for industrial positioning systems.
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Reliable Robotics has completed FAA detect-and-avoid data collection flights programme. The campaign generated validation data around airport operations and fed the next round of standards work for uncrewed aircraft integration.
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Renesas rad-hard ICs are flying on NASA’s Artemis II mission. The devices are being used across Orion and the Space Launch System in avionics, launch safety, power distribution, signal integrity, and onboard computing.
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ByteSnap’s new guide tracks how PCB priorities change by sector. The report moves from cost-led consumer layouts to industrial and aerospace boards shaped by harsher environments, tighter compliance, and longer validation cycles.
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March exposed where power in electronics now truly sits globally. Silicon still set the pace, but memory, power, optics, packaging, and design infrastructure increasingly shaped who could build, ship, and scale.