Category: Products
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Danisense has strengthened operations leadership for precision current sensing growth. Hjalti Pall Thorvardarson joins as chief operating officer during wider demand for high-accuracy measurement.
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ROHM has expanded its 600V Super Junction MOSFET surface-mount portfolio. The new DFN8080-5L and TOLL package options target high-density power supplies for AI servers and industrial equipment.
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Panasonic has expanded PIR sensing options for automated building systems. PaPIRs+ targets lighting control, HVAC, smart infrastructure, and low-power presence detection.
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Europe’s RISC-V ecosystem has entered a new leadership transition phase. Quintauris has appointed Pedro Lopez as CEO as it continues work on compatible platforms and reference architectures.
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AI demand is reshaping memory allocation across semiconductor markets globally. SEMI has warned that intervention in memory markets could worsen supply pressure as HBM pulls capacity from conventional DRAM.
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Switzerland’s photonics manufacturing base is moving toward industrial production scale. CCRAFT has raised $7.8m to expand thin-film lithium niobate chip manufacturing in Neuchâtel.
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AI infrastructure is tightening board-level power delivery and thermal limits. Flex Power Modules has introduced the BMR353 eighth-brick intermediate bus converter for high-density data-centre designs.
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Secure storage and board-level protection are converging around AI infrastructure. Swissbit and Nexperia are working together on high-reliability platforms for cloud, server, edge, and industrial systems.
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Backend semiconductor capacity is moving into the design conversation fast. SEMI and TechSearch International have expanded their assembly and test database to cover more than 820 global facilities.
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Microchip has removed licensing costs from core embedded development tools. MPLAB XC Pro Compilers and the MPLAB Machine Learning Development Suite are now available at no cost.