Category: Products
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Innodisk has introduced a 10GbE LAN module portfolio for edge AI systems, combining M.2 and PCIe form factors with Intel Ethernet controllers, DPDK, PTP, SR-IOV, and wide-temperature options.
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SEMI FlexTech has opened a 2026 request for proposals covering flexible hybrid electronics, bonding reliability, 2D materials, and flexible energy storage, with Army Research Laboratory funding.
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Analog Devices will acquire Empower Semiconductor for $1.5bn, adding integrated voltage-regulator and silicon-capacitor technologies for high-density AI compute power delivery.
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TDK will use PCIM Europe 2026 to show passive components, sensors, contactors, µPOL converters, and power-stage technologies for AI data centres, electrification, industrial drives, and EV infrastructure.
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Variscite is preparing the VAR-SMARC-MX95 system-on-module, combining NXP i.MX 95 processing, edge AI acceleration, real-time coprocessors, safety architecture, and SMARC compatibility.
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Allegro MicroSystems will demonstrate current sensing and isolated gate-driver technologies at PCIM 2026, targeting SiC and GaN power designs for AI data centres and 800V EV architectures.
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TDK’s FS3303 micro POL module delivers 3A in a 2.5mm x 2.5mm footprint, targeting optical modules, AI edge systems, ASICs, SoCs, DSPs, and dense low-voltage rails.
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ROHM has introduced configurable PMIC and DrMOS devices for automotive SoC power rails, targeting ADAS, sensing cameras, driver monitoring, cockpit systems, and domain-controller architectures.
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Ericsson and Net Feasa are combining onboard 4G/5G connectivity, satellite backhaul, and agentic AI to support live cargo visibility, vessel telemetry, and container monitoring at sea.
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ROHM has developed a configurable automotive SoC power solution using the BD968xx-C PMIC series and BD96340MFF-C DrMOS. The platform targets ADAS, driver monitoring, sensing cameras, and domain-controller architectures.