Category: Processors
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Congatec has launched a COM-HPC module for demanding edge AI. The conga-HPC/cRX1 combines CPU, GPU, and NPU computing with industrial-temperature operation, high-bandwidth memory, and extensive expansion interfaces.
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Farnell has expanded edge-AI access through a global Hailo partnership. The agreement adds processors, accelerator modules, and development systems for industrial vision, robotics, transport, and connected infrastructure.
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Aetina is extending Jetson Thor systems across lower-power robotics platforms. Fan-cooled and fanless designs will support NVIDIA’s T3000 and T2000 modules for physical-AI, machine-vision, and industrial edge deployments.
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British funding will expand Gripen E training and support capacity. The €300 million package covers simulators, engineering instruction, spares, equipment, and UK supply-chain work.
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Europe’s processor programme has completed its second major development stage. Demonstrations covered Rhea1 silicon, RISC-V acceleration, scientific software, design tools, and memory compression.
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Infineon’s PSoC Edge kit unifies processing, sensing, and wireless connectivity. The platform supports multimodal edge-AI development across industrial, medical, wearable, and robotic systems.
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NXP’s i.MX 95 processors are now entering wider distribution channels. The platform combines heterogeneous Arm processing, neural acceleration, security, and high-speed industrial connectivity.
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Microsoft will deploy AMD’s Helios rack architecture across Azure infrastructure. New processor-led virtual machines will support AI pipelines, EDA, and technical computing.
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Speedata has selected FlexNoC interconnect IP for its Callisto processor. The analytics accelerator moves Spark, ETL, and AI preparation into silicon.
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BAE Systems has combined visor displays, tracking, audio, and processing. Project Intuity explores sixth-generation combat-air cockpit interfaces.