Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.
Semiconductor equipment billings hit a new quarterly record in 2026. SEMI’s Q1 figures show capital spending concentrated around leading-edge logic, DRAM, and advanced packaging as AI infrastructure keeps pulling investment towards wafer fabrication and package-level integration.
Microchip’s Armenian engineering team has gained advanced FPGA authorisation. The US export licence covers controlled semiconductor technology and related high-performance hardware, allowing approved engineers to work on selected FPGA programmes under defined compliance controls.
Bull and Foxconn will manufacture AI and cloud infrastructure across France and the Czech Republic. The partnership targets AI factories, neo-cloud providers, enterprises, and research institutions, with an initial investment expected to exceed €120m.