Category: Processors
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AMD will power Finland’s €387.8m LUMI-AI supercomputer with next-generation silicon. Instinct MI430X GPUs and 256-core sixth-generation EPYC processors underpin a BullSequana XH3500 system scheduled for deployment during 2027.
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AWS and NVIDIA will deploy two million additional GPUs globally. The programme extends through Blackwell Ultra, Rubin and Rubin Ultra hardware, Vera CPUs, NVLink Fusion, custom high-bandwidth memory, government infrastructure, and robotics.
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AMD EPYC processors now power Kodiak’s seventh-generation autonomous truck platform. The CPUs provide 80 PCIe lanes and boost clocks reaching 4.4 GHz for latency-sensitive sensor and planning workloads.
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IBM is designing a processor supporting native Arm and Z. The 2 nm chip contains 11 cores above 5.7 GHz while executing both instruction architectures within each core.
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Achronix has released JESD204C IP for high-bandwidth Speedster7t FPGA systems. The core supports 32 Gbps lanes, deterministic latency, and aggregate serial throughput reaching 1 Tbps.
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Aheesa and Zigma will commercialise Indian-designed VIHAAN-I networking silicon nationally. The distribution agreement follows first-pass silicon and moves the broadband SoC towards planned production in 2027.
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Primemas has detailed rack-scale CXL memory for demanding PNNL workloads. The Abaco project combines high-density controller silicon, Micron DDR5, and memory pooling to exceed 100TB per rack.
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Arduino has opened pre-orders for its industrial VENTUNO Q platform. The board combines Qualcomm edge-AI processing with deterministic STM32 control for robotics and sensor-rich embedded systems.
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SiFive has launched rackable RISC-V hardware for datacentre development workloads. BigSky combines 32 P870-D cores with DDR5, PCIe 5.0, Linux, and GPU support.
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Intel has detailed three architectures spanning datacentre, inference, and edge. Diamond Rapids, Crescent Island, and Wildcat Lake combine new compute, memory, packaging, and interconnect technologies.