Category: Processors
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Glass-core substrates are gaining momentum in advanced semiconductor packaging roadmaps. SEMI and Global Net Corp. forecast rapid growth as AI and HPC designs push conventional substrate materials toward larger formats, finer interconnects, and tighter dimensional control.
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AMD has expanded its Versal Prime Series Gen 2 adaptive SoC family with smaller devices aimed at embedded systems requiring high scalar compute in constrained footprints.
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Mouser is now stocking NXP’s i.MX RT1180 crossover MCUs, combining dual-core Arm processing, TSN switching, industrial Ethernet protocol support, and embedded security.
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Broadcom has introduced the BCM68850, a 50G PON gateway SoC with integrated edge AI acceleration, native Wi-Fi 8 compatibility, and advanced security features.
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Delos Data has launched its Nonstop AI platform, aiming to increase AI scale-up domain size and reduce GPU idle time through new server and interconnect management architectures.
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Alif Semiconductor’s Ensemble edge-AI microcontrollers will be shown at Hardware Pioneers Max, targeting on-device voice, image, transformer, and generative AI workloads.
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Keysight has introduced electrical-optical-electrical simulation in ADS 2026, allowing engineers to model complete high-speed optical links across transmitters, photonic circuits, and electrical receivers.
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Aetina will demonstrate edge AI systems for robotics, vision AI, cable assembly, and on-premise agentic workflows at COMPUTEX 2026.
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Nvidia has reported record first-quarter revenue of $81.6bn, as AI infrastructure demand continues to reshape processor, memory, networking, and power design.
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HighTec and SiFive are combining qualified compiler tooling with RISC-V processor IP to support safer automotive and industrial software development.