Astera Labs unveils PCIe seven interconnect portfolio spanning optical links. Aries 7 combines retimers, redrivers and optical components, with initial customer sampling planned for late 2026.
XMax agrees to acquire developer of vertical gallium nitride technology. The proposed Hexa Creation transaction centres on 1,200 V power semiconductor development rather than currently qualified commercial devices.
Xsight introduces programmable data processor designs for lower-power network infrastructure. The E1L family includes an eight-core 100 Gbps configuration with a 25 W thermal design power.
BOS Semiconductors joins Japanese research into automotive chiplet interconnect technologies. The South Korean semiconductor developer will contribute SoC and chiplet design expertise to MIRISE Technologies’ research and prototyping programme for future vehicle computing architectures.
Chips&Media has developed lossless compression technology for neural activation data. The semiconductor IP developer reports memory traffic reductions of between 35.2% and 53.5% across tested numerical formats, with hardware implementation targeted for the first quarter of 2027.
AMD is sampling enhanced Versal AI Core devices for space. Early customers can now build engineering models while Class Y qualification continues.