Category: Processors
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Code Metal has expanded its RF engineering capability through acquisition. Signal Processing Technologies adds SDR, spectrum sensing, and DSP expertise.
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STMicroelectronics has introduced secure silicon for post-quantum mobile services integration. ST54M combines NFC, eSIM, embedded secure element, and cryptographic acceleration in one die.
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SEMI will centre its materials conference on AI-era semiconductor constraints. The programme covers materials, packaging, quantum devices, manufacturing scale-up, and supply resilience.
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Micron and Anthropic are linking AI infrastructure to memory architecture. Their agreement covers HBM, DRAM, SSDs, supply, and workload-level optimisation.
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IBM has demonstrated sub-one-nanometre chip technology using a nanostack architecture. The research targets future gains in logic density, SRAM scaling, and energy efficiency.
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Tytan is advancing AI-guided interceptor drones for European air defence. Its work combines onboard sensing, autonomy, target tracking, and command-network integration.
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Infineon has started production of its RASIC CTRX8188F radar transceiver. The 8Tx8Rx MMIC supports centralised ADAS architectures, 4D imaging radar, and scalable vehicle sensing platforms.
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Quantinuum and HPE are linking quantum systems with HPC infrastructure. The collaboration covers architectures, workflows, interoperability, benchmarking, and customer use cases.
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GigaDevice and Qt are tightening industrial embedded GUI development workflows. The partnership brings Qt for MCUs support to the GD32H7 microcontroller platform.
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Infineon is virtualising automotive microcontroller evaluation through AWS infrastructure services. The platform supports early RISC-V assessment before physical hardware arrives.