Category: Processors
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Innodisk has introduced a 10GbE LAN module portfolio for edge AI systems, combining M.2 and PCIe form factors with Intel Ethernet controllers, DPDK, PTP, SR-IOV, and wide-temperature options.
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Analog Devices will acquire Empower Semiconductor for $1.5bn, adding integrated voltage-regulator and silicon-capacitor technologies for high-density AI compute power delivery.
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Variscite is preparing the VAR-SMARC-MX95 system-on-module, combining NXP i.MX 95 processing, edge AI acceleration, real-time coprocessors, safety architecture, and SMARC compatibility.
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TDK’s FS3303 micro POL module delivers 3A in a 2.5mm x 2.5mm footprint, targeting optical modules, AI edge systems, ASICs, SoCs, DSPs, and dense low-voltage rails.
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ROHM has introduced configurable PMIC and DrMOS devices for automotive SoC power rails, targeting ADAS, sensing cameras, driver monitoring, cockpit systems, and domain-controller architectures.
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ROHM has developed a configurable automotive SoC power solution using the BD968xx-C PMIC series and BD96340MFF-C DrMOS. The platform targets ADAS, driver monitoring, sensing cameras, and domain-controller architectures.
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MIKROE has launched ETH WIZ 3 Click for embedded Ethernet designs. The board combines WIZnet’s W55RP20 SiP, hardwired TCP/IP, dual-core Arm Cortex-M0+ processing, USB-C, SPI, UART, and mikroBUS compatibility.
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Kioxia has introduced the BG8 SSD series for OEM systems. The PCIe 5.0 drives use eighth-generation BiCS FLASH 3D NAND and target compact client designs requiring higher storage performance without moving away from small M.2 form factors.
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IC-Link by imec has joined TSMC’s 3DFabric Alliance, strengthening access to 2.5D and 3D packaging technologies for advanced ASIC, photonics, AI, HPC, mobile, automotive, and telecom designs.
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MaxLinear has launched Trinity for cloud-managed 5G wireless backhaul systems.