Category: Design engineering
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PerkinElmer and Covalent are combining instruments with specialist failure analysis. The collaboration targets ultra-trace contamination, corrosion, solder deterioration, organic degradation, and material failures across semiconductors, electronics, and batteries.
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Forwessun will distribute TRI board-test systems throughout the United Kingdom. The agreement combines test hardware with UK-designed fixtures, software, installation, maintenance, and production-lifecycle support.
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Technosert has automated PCB depaneling using ASYS precision production technology. The installation adds adaptive control, complete cut inspection, tool management, and connected-factory interfaces for regulated electronics production.
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A Munich ruling strengthens Infineon’s position in ongoing GaN litigation. The decision restricts affected Innoscience products in Germany, adding another consideration to device qualification and long-term sourcing.
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Defence electronics programmes are sharpening semiconductor strategy and supply assurance. Long-lifecycle platforms need chips that can support radar, communications, electronic warfare, sensing, and control systems.
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Mouser is supporting a virtual conference for automation engineers globally. Control Automation Day 2026 will cover AI, robotics, machine vision, control systems, and industrial automation technologies.
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AI demand is reshaping memory allocation across semiconductor markets globally. SEMI has warned that intervention in memory markets could worsen supply pressure as HBM pulls capacity from conventional DRAM.
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Keysight and IEMN have advanced sub-THz indoor 6G research testing. The demonstration used reflective intelligent surface technology to support dual-polarised non-line-of-sight connectivity.
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Switzerland’s photonics manufacturing base is moving toward industrial production scale. CCRAFT has raised $7.8m to expand thin-film lithium niobate chip manufacturing in Neuchâtel.
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AI infrastructure is tightening board-level power delivery and thermal limits. Flex Power Modules has introduced the BMR353 eighth-brick intermediate bus converter for high-density data-centre designs.