Category: Design engineering
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Safe and Secure targets critical infrastructure with auditable processor security.
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Microchip Technology and Sunny Smartlead have teamed up on ASA-ML-based ADAS camera modules, adding momentum to the push for standardised, secure, multi-vendor in-vehicle camera connectivity.
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Synopsys backs Artemis electronics modelling for lunar suits and connectivity.
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Emerson launches NI CHESS for lab-based aerospace RF link validation.
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Pickering Interfaces is using Microelectronics US 2026 to sharpen its push into semiconductor test, pairing modular switching hardware with a design environment intended to cut integration time and reduce the documentation burden in complex validation systems.
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TPK and ASE are moving into through-glass via packaging with a pilot line planned for the third quarter of 2026, adding another sign that glass-core substrates are edging closer to practical deployment in high-performance semiconductor packaging.
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Collabora has refreshed Apertis for longer-life industrial embedded Linux designs. The v2026 release moves to Debian 13, adds Weston as default, and strengthens SDK and package maintenance workflows.
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Same Sky has further expanded its IP-rated USB Type-C range. The new additions span USB 2.0 to USB4, with reflow-compatible UV-glued O-ring models for sealed designs.
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ByteSnap’s new guide tracks how PCB priorities change by sector. The report moves from cost-led consumer layouts to industrial and aerospace boards shaped by harsher environments, tighter compliance, and longer validation cycles.
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March exposed where power in electronics now truly sits globally. Silicon still set the pace, but memory, power, optics, packaging, and design infrastructure increasingly shaped who could build, ship, and scale.