Category: Design engineering
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IHP has released a European open-source assembly design kit today. It links heterogeneous chiplet concepts with manufacturable 2.5D semiconductor assembly.
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Anglia has added 3PEAK’s analogue and mixed-signal component portfolio range. The deal expands UK and European access to signal-chain and power-management ICs.
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Socionext is now developing an A14 compute chiplet validation platform. The device will validate CPU and xPU architectures for AI infrastructure.
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APEM and Alps Alpine Europe are expanding industrial HMI collaboration. The work targets integrated controls for material handling, machinery, and off-highway equipment.
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STMicroelectronics is advancing edge imaging beyond conventional camera component boundaries. Its FlightSense and BrightSense platforms combine depth sensing, vision, local processing, and low-power operation.
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Panasonic has brought its PhotoMOS selector app to Android devices. The tool helps narrow more than 400 photo-coupled MOSFET relay options.
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Anritsu has expanded RedCap testing for emerging 5G devices applications. The software covers throughput, handover, power, temperature, and band-combination checks.
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congatec and CODESYS are virtualising real-time industrial control workloads together. Their partnership combines a hypervisor and PLC runtime to consolidate mixed-critical functions.
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Sony Semiconductor has joined MIPI’s board as a Promoter member. The move strengthens image-sensor input into interface standards used across embedded vision, automotive, IoT, and mobile-influenced systems.
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Q2 2026 made electronics design constraints much harder to ignore. Memory, packaging, optics, EDA automation, edge AI, and power delivery all carried forward existing pressures, while adding sharper evidence of how advanced systems are now limited by more than processors alone.