Category: Design engineering
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Leankon has widened its NFC antenna range to nine modules. The expanded 13.56 MHz line packages ferrite-backed, connector-ready options into a broader off-the-shelf portfolio for healthcare, access control, and industrial IoT hardware.
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Teradyne is pushing board test further into AI server manufacturing. Omnyx combines structural, parametric, high-speed interconnect, and operational test in one platform for complex data-centre hardware.
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Europe’s ferroelectric memory push has reached an important manufacturing test. CEA-Leti and Fraunhofer IPMS have completed the first wafer exchange inside the FAMES pilot line for HZO-based memory stacks.
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Microelectronics US 2026 brings applied design constraints into sharper focus. The Austin event will gather engineers across semiconductors, photonics, and embedded systems to address packaging, thermal density, supply chains, functional safety, embedded AI, and secure deployment.
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Kight is turning domestic batteries into a scaled manufacturing proposition. Its planned Dumfries plant would assemble AI-managed 10kWh home storage systems built around a non-graphite anode chemistry and an EnergiFlow control stack tuned to tariff, demand, and grid signals.
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ROHM is turning SiC module evaluation into reusable inverter platforms. Three new reference designs package board-level design data around its latest modules across industrial and automotive power-conversion applications.
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Anglia has widened Digi coverage across the Nordics and Baltics. The extension brings local technical and commercial support as the distributor steps up demand creation around wireless, embedded Linux, and industrial IoT platforms.
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Sheffield is leading a new national semiconductor design centre. The £12.5 million programme will focus on heterogeneous systems, advanced integration, and shared design infrastructure for UK electronic systems development.
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PLS has widened MCU runtime profiling beyond dedicated trace hardware. UDE 2026 adds CPU-load sampling through the debug interface, opening analysis to microcontrollers where trace support is limited or absent.
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Keysight has extended optical component validation to 220 GHz. The new platform targets the measurement bottlenecks emerging around 1.6T and 3.2T optical transceiver development for AI and data centre interconnects.