Category: Design engineering
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Molex has launched HSAutoLink G for faster automotive Ethernet links. The connector system supports ADAS, LiDAR, radar, displays, and zonal architectures.
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Kingboard has raised funds to expand advanced PCB production capacity. The placement supports laminate, multilayer, HDI, and R&D investment.
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Somacis has completed the Group ACB deal, expanding PCB capacity. The move adds French and Belgian manufacturing sites to a wider high-reliability electronics platform.
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Keysight and WIN have linked GaN MMIC design workflows tightly. The environment joins simulation, layout verification, and evaluation-board optimisation before tapeout.
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SiTime has launched Chorus 2 timing devices for compute systems. The programmable clocks target AI clusters, networking, smart-factory vision, and heterogeneous boards.
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Lattice has brought CrossLinkU-NX SoM hardware into wider distribution channels. The FPGA board targets embedded vision, USB connectivity, sensors, and edge-AI prototyping.
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Kvaser has introduced PCIe 4xLIN for multi-channel LIN validation systems. The card supports deterministic communication, isolated channels, and hardware-in-the-loop test environments.
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ByteSnap says battery replacement could slow industrial IoT deployment plans. Its blueprint examines energy harvesting, low-power design, and maintenance-free sensor networks.
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SK keyfoundry has integrated EMC protection into automotive semiconductor designs. The Bi-SCR technology targets PMICs, motor drivers, and power-control ICs.
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Trelleborg has opened an automated European service centre in Germany. The facility adds robotics, clean-room handling, component assembly, kitting, and coating capability.