Category: Design engineering
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CEA-Leti and NcodiN are taking optical interconnects wafer-scale. Their collaboration moves nanolaser-based photonic interposers onto a 300 mm silicon photonics process aimed at future AI and high-bandwidth computing packages.
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Keysight and 3dB Labs have linked RF tools more tightly. The integration brings Keysight spectrum and FieldFox analysers into Sceptre, creating a unified workflow for signal monitoring, recording, playback, and post-event analysis.
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Farnell has added Same Sky to its global distribution roster. The deal gives Same Sky wider reach through Farnell in EMEA, Newark in North America, and element14 in Asia Pacific.
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digid is packaging nanoscale sensing for easier industrial system integration. The company is pairing microscopic force and temperature sensors with full integration and routing support.
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Texas Instruments has launched two MCU families with integrated TinyEngine neural processing units, targeting low-cost edge AI inference and intelligent real-time motor-control applications.
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PTC has pushed model-based definition deeper into Onshape’s cloud workflow. The release brings PMI, GD&T, and inspection-ready data into a browser-native workflow.
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Embedder has moved its AI firmware platform closer to deployment. An embedded award nomination and a broader silicon-aware validation stack are pushing the tool beyond generic code assistance.
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Coating throughput is becoming a harder limit in electronics assembly. Rehm’s new RDS UV dryer is aimed at curing UV coatings and adhesives in seconds while cutting energy waste and keeping line integration straightforward.
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LurexX is licensing IMSE to model and validate in-mold lighting. The partnership adds optical simulation and measurement to TactoTek’s smart-surface ecosystem, supporting dynamic surface illumination and light lines within ultra-thin moulded structures.
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Holyvolt has bought Wildcat to speed battery chemistry to scale. The $73m deal ties high-throughput materials discovery to screen-printed, water-based manufacturing aimed at faster pilot production and lower-cost industrialisation in Europe and North America.