Category: Design engineering
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ServiceNow and Accenture have launched OT-focused cyber migration services globally. The offer brings industrial control risk into wider AI-supported governance workflows.
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Assel has upgraded its Polish SMT line with ASM systems. The investment targets higher placement accuracy, shorter changeovers, and greater capacity.
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Analogue test hardware is gaining more realistic simulation capability now. Pickering has added PXI and PXIe modules for waveform generation, DAC outputs, thermocouple simulation, functional test, and HIL.
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Diamond semiconductor quality control is becoming faster and reproducible now. Rice University researchers have automated defect measurement using Python software and high-resolution X-ray diffraction data.
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Low-power wireless prototyping is moving closer to final products now. Nordic’s nRF54L15 Tag combines Bluetooth Channel Sounding, sensors, NFC, Matter, Thread, and edge-AI support.
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Rail inspection data is outgrowing manual depot transfer methods now. Westermo, Eviden, and Blu Wireless have demonstrated multi-gigabit mmWave train-to-ground communications for Deutsche Bahn.
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Quantum sensing is entering Europe’s semiconductor inspection production chain quickly. QuantumDiamonds will build a Munich test-equipment facility with €76m in German support.
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TDK has introduced 3D Hall switches for compact drive applications. HAL 13xy targets motor speed and direction sensing.
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Thintronics has been recognised for low-loss dielectric materials development work. Its materials target boards, packages, and semiconductor interconnect structures.
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La Luce Cristallina releases beta 200mm wafers for photonics evaluation. The BaTiO₃ platform targets low-voltage electro-optic modulator designs.