Category: Design engineering
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eMaint has launched its first global maintenance partner network today. The Fluke business is formalising implementation, certification, and service support across industrial CMMS and EAM markets.
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FORTEC UK has expanded the compact Delta medical power range. The MEP-500A family now includes open-frame, enclosed, and top-fan cooled 500W models.
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Dynex Semiconductor has developed a high-current 650V GaN power module. The 450A half-bridge design uses PCB embedding and double-sided cooling for dense industrial power conversion.
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Oriole Networks is deploying photonic AI networking with AMD hardware. The UK startup’s PRISM platform will be tested inside ARIA’s Scaling Inference Lab for latency, throughput, and accelerator utilisation.
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Kimball Electronics has acquired Dutch medical CDMO Helvoet Polymer Technologies. The €90m deal expands micro-moulding and precision manufacturing capability for diagnostics, microfluidics, and drug delivery.
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Berlin researchers have reached certified CIGS-perovskite tandem cell efficiency records. The 25.5% result strengthens thin-film photovoltaic development where interfaces, stability, and manufacturable scale remain decisive.
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PureFize has demonstrated Far-UVC emission from a tunable platform today. The Swedish developer’s field-emission and cathodoluminescence approach targets compact disinfection systems below 240nm.
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Allegro DVT is backing the European CHASSIS automotive chiplet programme. Its video IP will help the 5nm base die handle camera, cockpit, and software-defined vehicle workloads.
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Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
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MKS is expanding Atotech manufacturing capacity for AI infrastructure demand. The Guangzhou investment targets semiconductor, advanced packaging, and PCB process equipment.