Category: Design engineering
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Incap has added cleanroom assembly capability at its Slovak facility. The Námestovo site now supports ISO 6–7 controlled electronics production.
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TE Connectivity has expanded compact interconnect options for industrial designs. AMP SMC essential connectors target board-to-board and board-to-wire applications.
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Microchip has introduced a radiation-tolerant clock generator for spacecraft systems. The DSA504RT provides six programmable outputs for low-jitter aerospace and defence timing.
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Dialight will showcase industrial LED lighting for hazardous downstream sites. The display focuses on reliability, safety, efficiency, and harsh-environment operation.
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Inelco Hunter has added Amphenol liquid-cooling connectors for power-dense systems. The range targets AI data centres, EV charging, storage, and energy infrastructure.
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Saelig has introduced the Joulescope JS320 precision DC energy analyser. The instrument targets low-power embedded development, battery-life estimation, and firmware optimisation.
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SEMI will centre its materials conference on AI-era semiconductor constraints. The programme covers materials, packaging, quantum devices, manufacturing scale-up, and supply resilience.
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Micron and Anthropic are linking AI infrastructure to memory architecture. Their agreement covers HBM, DRAM, SSDs, supply, and workload-level optimisation.
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IBM has demonstrated sub-one-nanometre chip technology using a nanostack architecture. The research targets future gains in logic density, SRAM scaling, and energy efficiency.
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Acbel is bringing integrated EV power conversion systems to Munich. The showcase includes 400V and 800V onboard charger and DC/DC converter architectures.