Category: Design engineering
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Ansell has introduced a controlled-glare floodlight for outdoor padel courts. The Exa-C combines high efficacy, precision optics, and robust environmental protection.
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Microchip has expanded FPGA edge-AI deployment with sparse-network acceleration tools. VectorBlox 3.0 targets lower memory traffic, power use, and inference latency.
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Arm is extending automated hardware-security analysis across future CPU programmes. The work moves vulnerability detection earlier while preserving reusable assurance across designs.
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IQE has secured a $14m wafer order for AI infrastructure. Production at Newport will support high-speed storage, optical communications, and data-centre systems.
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HistoSonics has secured European approval for its image-guided histotripsy system. The clearance opens a phased rollout for non-thermal treatment of selected liver tumours.
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Prima Electro will debut its custom electronics capability at Farnborough. Its offer spans embedded systems, power electronics, industrialisation, manufacturing, and programme support.
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Rohde & Schwarz combines fast capture with mixed-domain EMC debugging. The MXO 3 links waveform acquisition, spectrum analysis, and high-resolution measurements for earlier fault isolation.
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Spain is connecting domestic semiconductor research, design, and manufacturing projects. The programme spans RISC-V chiplets, analogue IP, prototyping, materials, and edge processing.
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Nippon Kinzoku is expanding ultra-thin electrical steel for efficient motors. Laminations below 0.1mm are intended to reduce high-frequency core losses in compact motors, transformers, reactors, compressors, and power-conversion equipment.
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Imec and Diraq have expanded silicon spin-qubit control to eight. The 300mm CMOS-compatible array combines coherent operation, shared readout, and adjacent two-qubit gates while exposing the manufacturing demands that will shape larger quantum processors.