Category: Design engineering
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Keysight and SRC UK are collaborating on electronic warfare test and simulation, combining EWASP scenario generation with local engineering, mission data, integration, training, and support for software-defined EW environments.
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IC-Link by imec has joined TSMC’s 3DFabric Alliance, strengthening access to 2.5D and 3D packaging technologies for advanced ASIC, photonics, AI, HPC, mobile, automotive, and telecom designs.
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Rohde & Schwarz has added new tools for wide-bandgap validation.
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Diodes has introduced the PI3EQX32904Q, a 32Gbps four-channel automotive ReDriver for PCIe 5.0, SAS4, and CXL links in smart cockpit platforms.
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Diodes has introduced the PI3EQX32904Q, a 32Gbps four-channel automotive ReDriver for PCIe 5.0, SAS4, and CXL links in smart cockpit platforms.
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ispace and the University of Leicester have signed a payload agreement to deliver a Raman analytical spectroscopy instrument to the Moon on a future commercial lunar mission.
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ispace and the University of Leicester have signed a payload agreement to deliver a Raman analytical spectroscopy instrument to the Moon on a future commercial lunar mission.
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MIPI Alliance has opened participation in a Physical AI Birds of a Feather group, examining interface requirements for humanoid robotics and embodied AI systems.
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MIPI Alliance has opened participation in a Physical AI Birds of a Feather group, examining interface requirements for humanoid robotics and embodied AI systems.
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Emerson is expanding NI Nigel AI across its test software portfolio. The update brings prompt-based code generation into LabVIEW+ and extends context-aware assistance across FlexLogger, InstrumentStudio, TestStand, and SystemLink.