Category: Design engineering
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January’s electronics agenda narrowed around power, packaging, and policy constraints. CES announcements pushed compute into rack-scale platforms, while memory supply and advanced packaging capacity dictated what could realistically ship. Export controls and EU security obligations tightened the design perimeter around compliance, updateability, and regional configuration management.
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CSA Catapult is pushing vertical GaN as net-zero infrastructure enabler. A new white paper argues GaN-on-GaN vertical devices can handle higher voltages and power densities than lateral structures, with implications for EV charging, renewable grids, and data centre power conversion.
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Microsoft has detailed Maia 200, its latest inference accelerator silicon. Built on TSMC 3nm, the chip pairs FP8/FP4 tensor cores with 216GB HBM3e, targeting higher token-throughput per watt in Azure-scale deployments.
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MEAN WELL’s SPWM drivers add tunable lighting control options now. The 75W to 240W constant-voltage range supports DALI-2 dimming and colour control, push-button input, and multi-channel PWM outputs, with minimum dimming down to 0.1% for smart building lighting deployments.
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Keysight has released a machine learning toolkit targeting faster semiconductor modelling. The new software aims to cut compact model development and parameter extraction times from weeks to hours, accelerating PDK delivery and design technology co-optimisation workflows across advanced logic, RF, and power devices.
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SK hynix is accelerating capacity as HBM demand tightens again. The company is expanding near-term output via M15X and progressing its Yongin cluster plan, with the first fab scheduled for completion in May 2027 and designed to produce next-generation DRAM, including HBM.
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Fluorescent chloride sensors are moving from lab novelty to product. A Research and Markets report forecasts growth from $4.27bn in 2025 to $6.36bn by 2032, driven by new fluorophores, nanomaterials, and tighter digital integration.
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Enphase has started shipping GaN microinverters into US rooftops now. The IQ9N-3P targets 480Y/277V three-phase commercial solar, using GaN in the power stage to reach up to 97.5% efficiency and higher power density.
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Vertiv launches new configurations of its MegaMod HDX solution. The prefabricated infrastructure supports high-density computing environments, offering flexibility to meet escalating power and cooling needs. The compact solution supports up to 13 racks, while the combo solution accommodates up to 144 racks, with capacities reaching 10 MW globally.
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SGET has released an open FPGA module specification aimed at standardisation. The Open Harmonized FPGA Module specification targets reduced design complexity, improved portability, and vendor-neutral scaling across FPGA and SoC-FPGA platforms for industrial, communications, and embedded applications.