Category: Design engineering
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TTTech will deliver 10Gb TSN networking for Army HADES jets. The contract covers a deterministic Ethernet platform and software intended to upgrade the ISR fleet’s digital backbone for high-throughput, time-bounded data transport.
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Mastercam 2026.R2 shifts simulation workloads from CPU to GPU hardware. A new GPU-accelerated verifier and the Copilot assistant target faster toolpath checks and fewer repetitive edits, as the company moves to a twice-yearly major release cadence.
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ifm’s O2I2 readers pack high-speed code capture into tight footprints. The compact multicode units read up to 50 codes per second, apply deep learning for damaged marks, and connect via Ethernet or RS232 for tracking, AGVs, and semiconductor traceability.
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Blueshift will bring low-outgassing thermal tapes to JEC World Paris. The company is positioning AeroZero tapes and flame barriers for lightweight spacecraft and aerospace electronics protection.
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Teledyne FLIR OEM has launched a new long-range thermal ISR camera. The Neutrino SX8 ISR 50-1000 extends detection ranges for border, perimeter, and counter-UAS applications, with a factory-integrated continuous zoom lens and AI-ready architecture.
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Richardson Electronics has added Nxbeam MMICs to its RF portfolio. A global agreement broadens access to GaN and GaAs devices up to 76 GHz for radar, satcom, and test equipment designs.
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Renesas has pushed Wi-Fi 6 into its RA6 combo MCUs. The RA6W1 and RA6W2 integrate Ceva wireless IP to reduce external radios, simplify PCB layouts, and cut BOM cost for IoT designs.
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Teledyne starts production of infrared modules for SDA Tracking Layer. The company says its radiation-hardened Focal Plane Modules will support Tranche 3 satellites designed to expand missile warning and tracking from Low Earth Orbit.
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EnSilica joins the CHERI Alliance to harden custom ASICs today. The mixed-signal supplier says it will use CHERI capability-based hardware techniques to strengthen memory safety for automotive and industrial silicon.
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UK Space Agency funded three studies for orbital materials manufacturing. Space Forge and OrbiSky will examine semiconductor seed crystals and ZBLAN fibre production in Low Earth Orbit, targeting higher-performance power electronics and lower-loss optical links.