Category: Design engineering
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Fraunhofer has urged Germany to accelerate applied research-to-industry technology transfer. The call reflects growing pressure on industrial innovation.
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Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration. The 300mm work points beyond silicon logic scaling.
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.
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Adhesive selection demands equal attention to material performance and process. Peter Swanson, Executive Chair and Founder at Intertronics, explains why production trials, surface preparation, dispensing, curing, and QA must shape adhesive specification.
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Our latest issue examines resilient electronics supply chains under pressure. It spans medical technology, AI-ready networks, component availability, data integrity, and connected-device compliance.
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Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
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Siemens and Samsung Foundry are extending advanced-node EDA collaboration flows. The work covers verification, test, packaging, analogue, RF, and implementation.
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RISC-V Summit Europe has opened in Bologna around deployable hardware. The programme spans embedded systems, AI, automotive, security, software, and space.
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CEA-Leti and GlobalFoundries are extending FD-SOI research through Europe’s FAMES. The pilot line targets low-power, sovereign silicon for advanced applications.