Category: Design engineering
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AMUK’s annual plan maps priorities for UK additive manufacturing industry. The third Annual Action Plan sets out a 12-month agenda focused on supply chain maturity, workforce skills, and standards, against a backdrop of tough UK trading conditions.
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MathWorks has joined the EDGE AI Foundation as a member. The move links MATLAB and Simulink workflows with a wider push for energy-efficient edge AI, spanning model training, system simulation, code generation, and deployment across embedded targets.
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Keysight and Samsung are validating AI-RAN from lab to air. At MWC Barcelona, the pair and NVIDIA are demonstrating a single workflow for dataset generation, AI/ML training, and benchmarking, using a PUSCH channel-estimation use case.
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XPENG is advancing VLA 2.0 and updating European vehicles now. Global delivery of the next-generation vision-to-action driving stack is planned from 2027, while XOS 5.8.7 begins rolling out in Europe this month with refinements to ACC, lane centring, and connectivity.
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Delta has acquired its German building automation integration partner outright. The deal folds Delta Controls Germany’s European integrator network into Delta’s smart-building portfolio, as building automation and control requirements tighten across the region.
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Molex pushed coaxial test assemblies to 145 GHz limits now. Its latest Cardinal multi-port coaxial assemblies target dense lab setups for AI interconnect and 5G/6G validation, with phase-matched connections and data characterisation rates up to 448 Gbps.
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L3Harris says additive manufacturing is reshaping airbreathing hypersonic propulsion production. The company reports a tenfold reduction in 3D-printed component lead times under a US DoD manufacturing programme.
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Iridium has unveiled a three-radio module for global IoT deployments. The Iridium 9604 integrates Iridium SBD satellite, LTE-M cellular, and multi-constellation GNSS, with commercial availability set for June 2026.
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SEALSQ increased its EeroQ stake to back helium-qubit development further. The follow-on investment targets a US-centred quantum hardware roadmap, and a planned Geneva demonstration linking quantum processors with post-quantum secure semiconductor components.
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Rice researchers patterned diamond cooling layers across 2-inch semiconductor wafers. The team reports selective-area diamond growth that cut device operating temperatures by 23°C, using process flows intended to fit heterogeneous integration and high-power electronics.