Infineon will supply SiC modules for Siemens semiconductor circuit breakers.
ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.
Mouser is shipping TDK’s AMT45S pulse transformer for EV charging. The compact component targets power line communication circuits used in CCS and NACS charging systems, supporting isolation, signal integrity, and charging control.
Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.
Semiconductor equipment billings hit a new quarterly record in 2026. SEMI’s Q1 figures show capital spending concentrated around leading-edge logic, DRAM, and advanced packaging as AI infrastructure keeps pulling investment towards wafer fabrication and package-level integration.
Power Integrations has introduced compact 800VDC auxiliary PSU designs. The 15W and 35W flyback references use 1700V PowiGaN InnoMux-2 ICs for high-voltage AI data-centre architectures based on NVIDIA Kyber.
Atomera is targeting RF GaN-on-silicon performance with MST processing. The approach uses an oxygen-modified silicon layer to reduce parasitic channel charge, aiming to narrow the performance gap between lower-cost silicon substrates and established RF GaN-on-SiC platforms.