Category: News
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Microchip’s Armenian engineering team has gained advanced FPGA authorisation. The US export licence covers controlled semiconductor technology and related high-performance hardware, allowing approved engineers to work on selected FPGA programmes under defined compliance controls.
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SemiQ will show expanded SiC power modules at PCIM Europe. The portfolio includes QSiC Dual3 devices, AlN substrate options, pre-applied thermal interface material, and high-current packages for AI infrastructure, EV charging, storage, solar, and industrial drives.
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Toshiba has introduced automotive MOSFETs for compact power switching designs. The 40V N-channel devices use SOP Advance(EWF) packaging to improve current capability, reduce on-resistance, and support vehicle systems including load switches, relays, inverters, and motor drives.
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Siemens and HighByte are tightening industrial AI data integration workflows. The partnership brings HighByte Intelligence Hub into Siemens Industrial Edge, giving manufacturers a structured route from PLC, SCADA, MES, and enterprise data into AI-ready industrial applications.
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Marktech has expanded its COTS and custom photodetector and LED capabilities with transfer-moulded packaging technology. The platform targets defence and aerospace sensing, targeting, and optical alignment systems requiring compact, rugged, and repeatable optoelectronic packages.
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MIKROE has introduced Life Metrics Click, a biomedical add-on board built around the ams OSRAM AS7058A analogue front end. The board supports PPG, ECG, BioZ, EDA, temperature, and motion measurements for wearable and embedded health designs.
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Astute Group has added UK stock of ATS thermal management products for NVIDIA Jetson modules. The range covers active heatsinks, passive options, and thermal transfer plates for robotics, edge computing, smart monitoring, and physical AI systems.
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Infineon has integrated its OPTIGA TPM SLB 9672 with NVIDIA Jetson Thor. The hardware root of trust secures keys, verifies software integrity, and supports post-quantum update protection for physical AI systems and robot fleets.
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ROHM’s 750V SiC MOSFET has been adopted in a battery backup unit for AI server power supplies. The device supports high-voltage DC architectures as rack-level power systems move toward higher voltage and density.
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JEDEC has released JEP203 and JEP204 for silicon carbide power semiconductors. The documents cover short-circuit evaluation and stress procedures, supporting more consistent qualification of SiC devices in EVs, industrial drives, renewable systems, and high-power electronics.