Silicon Line has launched a dual-port 20Gbps MIPI SerDes chipset. The architecture extends camera links over optical fibre or differential copper while limiting interconnect power in constrained imaging systems.
Avalon and Zollner are forming an Indian electronics manufacturing venture. The operation will combine PCBA, box-build, integration, testing, sourcing, and lifecycle services for industrial and high-reliability equipment.
Wacker’s Tennessee polysilicon plant faces renewed uncertainty after customer losses. US trade measures are now colliding with the economics of domestic semiconductor-grade production.
Everspin and Teledyne HiRel are expanding mission-critical MRAM availability together. Their partnership brings 256Mb PERSYST STT-MRAM into an aerospace and defence memory portfolio, with customer availability planned for the fourth quarter.
Anritsu and MediaTek have verified Release 17 coverage-enhancement tests together. The work exercises uplink mechanisms intended to improve 5G reliability at cell edges, deep indoors, and in other weak-signal conditions.
Peer Software is accelerating Würth Elektronik’s global CAD collaboration workflows. PeerGFS synchronises engineering data across three continents, providing local file access while controlling conflicting edits and supporting recovery after infrastructure failures.
China-based panel makers are extending their automotive display shipment lead. Omdia forecasts their global share reaching 65.2% in the second half of 2026 as mature LCD capacity consolidates elsewhere.
Vishay has introduced compact RF resistors rated to 50GHz operation. The CHEP thin-film series combines aluminium-nitride substrates with high power ratings in standard 0402 and 0603 surface-mount footprints.