GlobalFoundries has released PDKs for two new UX process platforms. 40UX targets ultra-low-power MCUs and connectivity, while 22UX adds analogue, sensing, imaging, and edge-AI capability.
Innolux has unveiled Chip-Last FOPLP for advanced semiconductor packaging production. Its HIPoS platform uses 620 × 670mm panels and targets 2/2µm redistribution-layer geometry ahead of planned 2027 mass production.
GlobalFoundries and RAAAM have taped out GCRAM test silicon successfully. Their FDX implementation targets 40% less memory area and power reductions reaching 60% against conventional SRAM.
TT Electronics has raised expectations after first-half profitability improved sharply. Cleveland is profitable again, Components has returned to profit, and the group expects 2026 adjusted operating profit to beat current market expectations.
The UK semiconductor sector now spans 703 active companies nationwide. Dedicated businesses generated an estimated £10.6 billion in revenue and £7.5 billion in GVA during 2025, while skills, scale-up finance, and energy costs remain barriers.
Infineon and Skeleton will develop denser AI power delivery systems. Their MoU covers SiC solid-state transformers and GaN peak-shaving sidecars using supercapacitor storage.
A Release 17 power-saving conformance test has passed initial verification. Rohde & Schwarz and Qualcomm Technologies have moved SSSG closer to formal 5G NR certification.
Fraunhofer has opened a cryogenic electronics laboratory in Chemnitz, Germany. CRYME extends semiconductor reliability testing to 4 K for quantum and heterogeneous integration research.