Category: News
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NEURA and SECO will build robot compute modules in Europe. The Qualcomm Dragonwing-based hardware will support distributed processing and planned series manufacture for cognitive robotics.
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Infineon has introduced dual-phase power stages for dense AI accelerators. The 6mm devices support 300A peak current, vertical power delivery, and liquid-cooling integration.
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Imec has demonstrated denser superconducting circuits using CMOS-compatible 300mm processing. The NbTiN platform reaches 3.8 million Josephson junctions per square centimetre and 30nm routing.
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Infineon brings secured NFC payments to mPTech’s latest Hammer smartwatch. The architecture combines embedded security, tokenisation, CDCVM support, and payment-network integration for active wearable devices.
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Silicon Labs has opened an advanced Austin chip R&D laboratory. The facility adds semiconductor design, test, and validation capability with support from a $23 million Texas Semiconductor Innovation Fund grant.
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NOVOSENSE is expanding GaN products for AI server power systems. Its portfolio spans AC-DC conversion, 800 V HVDC, rack-level conversion, isolation, sensing, gate driving, and real-time control.
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Makr Microsystems has raised funding for subsurface semiconductor metrology development. Its Acoustic Atomic Force Microscopy platform targets buried structures and defects that become harder to inspect as semiconductor devices and packages extend further into three dimensions.
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Ezurio has launched an AM67-based module for industrial edge AI. Carbon AM67 combines heterogeneous processing, machine vision, wireless connectivity, security, and industrial temperature support in a 45 × 30 mm OSM-MF format.
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5N+ plans US gallium arsenide component production for defence applications. A US$7.3 million award will support crystal growth, process control, inspection, qualification, and a route towards low-rate production in Utah.
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Global semiconductor equipment billings reached another record during second-quarter 2026. Spending rose 23% year-on-year and 11% sequentially as manufacturers continued investing in advanced semiconductor capacity.