Category: News
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QPT has launched qDesign for AI-optimised power module packaging workflows.
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Cambridge GaN Devices is sampling automotive ICeGaN for inverter designs.
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ODU has supplied mass interconnects for automated DEIF converter testing.
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Cyntec is showing battery junction box components for EV architectures.
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Fraunhofer IAF is demonstrating GaN power modules for bidirectional charging.
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Infineon will supply SiC modules for Siemens semiconductor circuit breakers.
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ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.
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Mouser is shipping TDK’s AMT45S pulse transformer for EV charging. The compact component targets power line communication circuits used in CCS and NACS charging systems, supporting isolation, signal integrity, and charging control.
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EnSilica has secured a seven-year automotive semiconductor supply contract. The UK fabless chipmaker will manufacture and supply an Arm-based sensing device already in production for a German automotive components customer.
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Siemens has launched Solido Characterizer for semiconductor library characterisation workflows. The software combines predictive AI and an AI-accelerated SPICE simulator to reduce Liberty file generation from weeks to days.