Category: News
-
Vishay has introduced 650W thick-film resistors for high-power electronics applications. The RPWA 650 series combines high-voltage operation, pulse handling, and optional integrated temperature sensing.
-
Silex has launched an i.MX 95 module for edge AI. The EP-200N combines heterogeneous processing, industrial interfaces, wireless integration, and extended-temperature operation for embedded OEM designs.
-
Solinide has raised €4 million to scale silicon-nitride photonics production. The Swedish company is commercialising microcomb sources for lower-power optical interconnects in AI infrastructure.
-
Silvaco and Dassault Systèmes are linking semiconductor manufacturing simulation workflows. The partnership connects plasma, feature-scale process, and structural models before engineers commit expensive fab resources.
-
SK hynix has mapped optical interconnect scaling beyond current HBM. The roadmap targets bandwidth, energy, and latency bottlenecks across next-generation AI compute and memory systems.
-
IBM has connected two cryogenic modules for larger quantum systems. The architecture is designed to support denser interconnects, multi-chip processors, and future fault-tolerant machines.
-
TekSiC has advanced European semi-insulating silicon carbide wafer supply efforts. GaN epitaxy has now been grown on the Swedish wafers ahead of RF and power HEMT validation.
-
Researchers have reduced micro-LED efficiency losses at micrometre-scale dimensions substantially. The dry repair process also improves yield, ESD robustness, and performance down to 1.6µm.
-
EPC has moved its EPC2370 GaN transistor into volume production. The 18V device targets high-current, high-frequency conversion in AI server power architectures.
-
Voltcraft has introduced twelve compact CSP laboratory power supply models. The range combines DC, AC, symmetrical-output, and battery-capable units for development, maintenance, field testing, and technical training.