Category: News
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FS has launched its 800G D7070 muxponder for datacentre interconnects. The 1U platform aggregates 100GbE and 400GbE services into coherent optical channels.
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Collins has completed altitude testing of the EPACS thermal system. The programme tested flight-representative power levels, emergency power, and performance models.
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Skyloom now has 84 optical terminals operating across low-Earth orbit. The latest installations support SDA’s interoperable Proliferated Warfighter Space Architecture communications network.
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Perceptia has released pPLL03 design IP for Samsung 14LPU silicon. The block supports 4GHz operation, fractional-N synthesis, low jitter, and compact SoC integration.
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SiFive has launched rackable RISC-V hardware for datacentre development workloads. BigSky combines 32 P870-D cores with DDR5, PCIe 5.0, Linux, and GPU support.
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Quintessent has begun sampling its quantum-dot DWDM comb laser platform. The eight-wavelength source targets simpler optical interconnects for expanding AI clusters.
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PCB Technologies has secured a major medical electronics manufacturing tender. Estimated sales of $65 million are expected across 2027 and 2028.
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Renesas has restored Kawashiri wafer input to pre-earthquake capacity levels. The recovery follows a phased restart begun ahead of the company’s original timetable.
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Intel has detailed three architectures spanning datacentre, inference, and edge. Diamond Rapids, Crescent Island, and Wildcat Lake combine new compute, memory, packaging, and interconnect technologies.
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Embedd has raised €2.3 million for semiconductor integration software development. Its platform uses digital hardware models and automation to accelerate embedded bring-up.