Category: News
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Emerson will supply Equinor measurement technology under long-term framework agreements. The scope covers instrumentation, analytical systems, and lifecycle services across global assets.
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STMicroelectronics and NUS have opened a four-year edge-AI research laboratory. HELIX will develop memory-centric architectures, accelerators, and silicon implementations for physical AI.
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Canatu has secured another reactor order for semiconductor pellicle manufacturing. The €5m-plus programme expands FST’s capacity for carbon-nanotube membrane production.
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Infineon is acquiring C2i to expand AI power management capabilities. The deal adds software-defined multiphase control expertise for denser processor power architectures.
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IOxOS is applying modular FMC architecture to scalable radar frontends. VITA 57.1 separates FPGA processing from replaceable converter and sensor-interface hardware for easier system reconfiguration.
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Researchers have modelled silicon-hydrogen bond failure from single electrons directly. The nonadiabatic framework connects transient antibonding states with hot-carrier degradation and long-term device reliability.
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Micross plans AEMtec acquisition to expand European packaging and testing. The proposed deal adds advanced assembly, optoelectronics, wafer back-end services, and cleanroom manufacturing in Germany.
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VIAVI has expanded Vertex channel emulation for emerging wireless systems. Version 6.0 adds wider bandwidth, FR3, Wi-Fi 7/8, NTN, and sensing-oriented test configurations.
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Yokogawa has introduced split-core sensors for high-current power measurement applications. The 200A and 500A devices combine clamp-on installation with wide bandwidth for inverter and energy-system testing.
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Researchers have improved weak-field GaN LEDs on manufacturable c-plane substrates. Digital-alloy quantum barriers reduced polarisation while preserving an industrial MOCVD-compatible epitaxial route.