TE Connectivity has launched its SCHRACK RSY industrial relay family. The compact PCB platform combines 10A switching, extended thermal operation, low-load contact reliability, and a lower product carbon footprint.
India’s C2S programme has expanded practical semiconductor design training nationwide. More than 68,000 students have been trained, while 254 chip designs have reached tape-out.
CACI has opened expanded defence electronics manufacturing capacity in Rochester. The 61,000ft² facility adds more than 300% manufacturing space for software-defined electronic warfare programmes.
BriteSemi has released dual-voltage 28nm SAR ADC IP for communications. The 12-bit converters deliver 125Msps sampling, 1.2mW core power, and a 0.07mm² footprint.
Prodigy has launched a UFS 5.0 protocol validation platform commercially. PGY-UFS5-EX-PA supports 46.64Gbps per lane, PAM4 acquisition, continuous capture, decoding, packet triggering, and error analysis.
Micron has launched a decade-long programme for advanced semiconductor research. The planned $10bn investment spans future memory, compute architectures, advanced packaging, and manufacturing technology.